| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive ball mounting method and a bump forming method whereby a bump defect is prevented without the need for an apparatus or an instrument of high accuracy when applying flux in a method of forming bumps on a substrate. <P>SOLUTION: In the conductive ball mounting method, flux is applied over an area where at least a circuit is formed on the substrate, and then conductive balls are mounted. In the bump forming method, the conductive ball mounting substrate is heated to melt the conductive balls, and then the conductive balls are cooled and solidified to form the bumps. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
