| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board that can reduce the impedance of signal through-hole conductors and grounding through-hole conductors or power supply through-hole conductors formed in a plate-shaped metallic core. SOLUTION: In a core through hole CH100A formed in the plate-shaped metallic core MC grounded with respect to high frequencies, one or more pairs of signal through-hole conductors SP101 and power supply through-hole conductors PP102, or grounding through-hole conductors GP101 are adjacently disposed. The routes of electric currents flowing through each pair of signal through-hole conductors SP101 and power supply through-hole conductors PP102 or grounding through-hole conductors GP101 are decided so that the phases of the electric currents may become reverse phases. COPYRIGHT: (C)2005,JPO&NCIPI |
