| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate which has an excellent dimensional accuracy and has a high bond strength and a high plating performance for a wiring layer as a surface electrode formed on a front or back surface. <P>SOLUTION: The method for manufacturing a multilayer ceramic substrate includes steps of: laminating a plurality of green sheets s1 to s3 having wiring layers 4, 6, 8, 10 formed on its front or back surface and sinter shrinkage suppressing sheets y1, y2 located on a front surface 1 and a back surface 2 of the uppermost and lowermost green sheets s1, s3 and having a sintering temperature higher than that of the green sheets s1 to s3 to form a composite laminate; sintering the composite laminate at the sintering temperature of the green sheets s1 to s3; removing unsintered sinter-shrinkage suppressing sheets y1, y2 in the composite laminate after sintered; and heating the wiring layers 4, 10 arranged on the front and back surfaces 1, 2 of the uppermost and lowermost ceramic layers S1, S3 at a temperature lower than the sintering temperature of the green sheets s1 to s3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
