| 摘要 |
PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting plating solution from the outside of the respective anode units; a first impurity removal means(30) for electrochemically removing impurities in the plating solution extracted from the anode chambers by the plating solution extraction supply means; a second impurity removal means(40) for mechanically removing impurities remained in the plating solution after passing through the first impurity removal means; and a plating solution return supply means(60) for supplying the returned plating solution by returning the residual impurity removed plating solution by the second impurity removal means from the inside of the plating pot to a cathode chamber(31K) outside the respective sealed anode chamber structures.
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