| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely solder a semiconductor part on a land which is so small that solder is printed only on the backside of the semiconductor part when the semiconductor part which is not sufficiently heat-resistant and not allowed to be introduced into a reflow furnace is mounted on a circuit board with high mounting density. <P>SOLUTION: The semiconductor part 1 equipped with metal terminals 2 formed on its backside is mounted on a circuit board 5 bringing only the backsides of the metal terminals 2 into contact with cream solders 3, and the sides of the metal terminals 2 are irradiated with a laser beam to heat the backsides of the metal terminals 2 through heat conducted from the backsides of the metal terminals 2, whereby the cream solders 3 coming into contact with the backsides of the metal terminals 2 are melted to solder the metal terminals 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
