| 发明名称 |
BACKUP SHEET FOR BORING THROUGH-HOLE BY UV LASER |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a backup sheet for boring a through-hole by the use of a UV laser beam, which is excellent in workability and bores the through-hole that is small in diameter and excellent in shape. <P>SOLUTION: In a through-hole boring process of boring a through-hole in a copper-plated board having two or more copper layers with a UV laser beam, the backup sheet is arranged on the surface of the outermost copper layer of the copper-plated board opposed to its other surface which is irradiated with a laser beam, and composed of a metal foil and a resin layer formed on the foil. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005064224(A) |
申请公布日期 |
2005.03.10 |
| 申请号 |
JP20030292141 |
申请日期 |
2003.08.12 |
| 申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
IKEGUCHI NOBUYUKI;AOTO HIROKI;HASHIMOTO HAMAO |
| 分类号 |
B23K26/00;B23K26/38;B23K101/42;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/00 |
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