发明名称 LINEAR MOTION MECHANISM OF ELECTRONIC COMPONENT SURFACE MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a linear motion mechanism of an electronic component surface mounting apparatus capable of securing the life of components, in a linear motion mechanism using a linear motor. <P>SOLUTION: In a Y-linear motion mechanism 6 that moves an X-linear motion mechanism 8 in the Y-direction by the linear motor consisting of a stator 16 and a mover 17, a suction force supporting portions structured to make guide rollers 21 contact guide rails 20 are provided on a drive transmitting portion that is linked to the mover 17 and transmits the Y-direction drive force of the mover 17 via a moving plate 18 and a connecting member 25. The suction force F that acts in the X direction between the stator 16 and the mover 17 is supported as a reaction force R that works between the guide rollers 21 and the guide rails 20. Thereby, the suction force is prevented from being loaded to a guide rail 7 and a slider 26 that guide the linear motion of a driven member, and the life of the components can be secured. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005065468(A) 申请公布日期 2005.03.10
申请号 JP20030296062 申请日期 2003.08.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KOMIYA TAKAHIRO;NAGAO KAZUHIDE
分类号 B25J9/00;H02K41/02;H05K13/04 主分类号 B25J9/00
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