| 发明名称 |
METHOD FOR FORMING BANK, METHOD FOR FORMING WIRING PATTERN, OPTOELECTRONIC DEVICE AND ELECTRONIC APPLIANCE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a bank by which a bank having a favorable figure can be formed with high productivity. <P>SOLUTION: A substrate 1 on which a sublimation layer 2 containing a sublimable material is disposed is irradiated with light to sublimate the sublimable material to form a bank B which sections a specific area of the substrate 1 on the substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005062355(A) |
申请公布日期 |
2005.03.10 |
| 申请号 |
JP20030290656 |
申请日期 |
2003.08.08 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
TOYODA NAOYUKI |
| 分类号 |
G03F7/004;B41M3/00;G02B3/00;G02B5/20;G02F1/1335;G02F1/1343;G03F7/36;H01J17/49;H01L27/32;H01L51/40;H01L51/50;H05B33/10;H05B33/12;H05B33/22;H05B33/26;H05K3/10;H05K3/12 |
主分类号 |
G03F7/004 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
