| 摘要 |
PROBLEM TO BE SOLVED: To largely improve suction capacity of chips by reducing area of a suction duct and increasing suction flow velocity of air without complicating the structure of a dividing device of a printed board mounting an electronic component. SOLUTION: This printed board dividing device has a small fixed suction opening having a suction section with a slender area under a printed board fixing fixture using a phenomenon where the movement of a spindle is limited to the X-direction. The suction flow velocity of the air is made 6 times larger than the conventional art to suck substantially 100 % of chips, and the printed board and the printed board fixing fixture are moved along a cutting position. COPYRIGHT: (C)2005,JPO&NCIPI
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