Improvements to packaged high frequency ceramic circuits,申请号GB20050001871-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Improvements to packaged high frequency ceramic circuits
摘要
申请公布号	GB0501871(D0)	申请公布日期	2005.03.09
申请号	GB20050001871	申请日期	2005.01.29
申请人	EADS ASTRIUM LIMITED	发明人
分类号		主分类号
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Sealing arrangement for hot bearing housings

Apparatus for insulating relatively flexible conductors

(Imidazolylmethyl)pyridine compounds as thromboxane synthetase inhibitors

Process for the manufacture of 3,6-dialkyl resorcylic acid esters

Cable laying apparatus

ESTER AND MANUFACTURE

Heat sealable packaging film comprising propylene polymer substrate and a surface layer blend of olefin copolymer or interpolymer

Fuel injection nozzle

Highly filled crosslinkable emulsion polymer composition

One-piece quilted mattress shield

Process for producing metal powders having low oxygen content

Junction box for housing cable connections

Process for the preparation of long-chain dicarboxylic acids by fermentation

Process for bonding wallpapers to wall insulations and composite sheeting prepared in accordance therewith

Solar collector

Cardioactive factor

Method for fabricating adjacent conducting and insulating regions in a film by laser irradiation

Heat exchanger with bilayered metal end container for anticorrosive addition

Tire cutting machine