| 摘要 |
<p>The information recording tag includes an IC module comprising a substrate (1) on which an IC chip (3) and a resonance circuit composed of a film capacitor (5) and of an antenna coil (2) are packaged, and an adhesive (17) that is applied to the IC module in order to affix said IC module onto an adherend (S), wherein the adhesive (17) is adhered to film type electrodes (7a, 7b) of the film capacitor (5), wherein the adhesive force between the adhesive (17) and the adherend (S) is greater than the adhesive force between the insulation film (6) of the film capacitor (5) and the film type electrodes (7a, 7b), and wherein a spacer material (18) is provided to the periphery of the film capacitor (5), an adhesive (17) is adhered to the spacer material (18), and the adhesive force between the adhesive (17) and the adherend (S) is greater than the adhesive force between the adhesive (17) and the spacer material (18). <IMAGE></p> |
