| 摘要 |
PURPOSE: To provide a black dull surface treated copper foil which is excellent in etching property, oxidation resistance, heat resistance and chemical resistance and has high peel strength, from which black particles are not stained, and which improves productivity and accomplishes a fixed surface roughness according to formation of a plating layer comprising a submicroscopic nodule having the same effect as the processes without performing of roughening process and barrier layer forming process, and a method for manufacturing the same. CONSTITUTION: The method for manufacturing a surface treated copper foil comprises a step(S100) of providing a copper or copper alloy substrate; and a step(S300) of electroplating one side surface or both side surfaces of the substrate using an electrolyte containing copper(Cu), cobalt(Co), iron(Fe) and nickel(Ni), wherein the step(S300) is performed using an electrolyte in which concentration of Cu is 0.1 to 2.0 g/L, concentration of Co is 0.1 to 10.0 g/L, concentration of Fe is 0.1 to 6.0 g/L, and concentration of Ni is 0.02 to 2.0 g/L, wherein the step(S300) is performed using an electrolyte in which concentration of Cu is 0.2 to 1.0 g/L, concentration of Co is 3.0 to 9.0 g/L, concentration of Fe is 1.5 to 4.0 g/L, and concentration of Ni is 0.1 to 1.5 g/L, wherein electrolytic treatment is performed in the step(S300) under the conditions that electrolyte temperature is 20 to 50 deg.C, pH is 0.5 to 6, treatment time is 2 to 30 seconds, and cathode current density is 0.5 to 20 A/dm¬2, wherein electrolytic treatment is performed in the step(S300) under the conditions that electrolyte temperature is 30 to 40 deg.C, pH is 1 to 3, treatment time is 5 to 20 seconds, and cathode current density is 2 to 15 A/dm¬2, and wherein direct current, pulse current, or direct current and pulse current is used during electroplating in the step(S300).
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