| 摘要 |
PURPOSE: A lead frame for a semiconductor package and an encapsulating method thereof are provided to be capable of maximizing the number of semiconductor packages without the increase of lead frame size. CONSTITUTION: A lead frame(100) is provided with a panel type metal frame(102), a space portion(108), and a plurality of lead units(112) formed at the inside of the space portion. At this time, the lead units include each lead(110) connected with the panel type metal frame. The lead frame further includes the first partial etching portions(114) formed at one side of the lead frame for easily flowing encapsulating material to each lead unit and the second partial etching portions(116) formed between the lead units for smoothly transferring the encapsulating material between the lead units. |
