Determination of nonphotolithographic wafer process-splits in integrated circuit technology development

摘要

A system of testing wafer process-splits in a semiconductor wafer is provided. A first test is performed on a semiconductor wafer in a plurality of locations to obtain first data. The first data is clustered into a plurality of bins to obtain process-split locations. Second tests are performed on the semiconductor wafer in the process-split locations to obtain second data. The first data and second data arc correlated to determine process-split data.