发明名称 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF TO PREVENT SURFACE ROUGHNESS OF SiGe LAYER FROM INCREASING IN FORMING CAP SILICON LAYER ON SiGe LAYER
摘要 <p>PURPOSE: A semiconductor device is provided to prevent the surface roughness of a SiGe layer from increasing in forming a cap silicon layer on the SiGe layer by forming the SiGe layer on a high dielectric layer such that the SiGe layer has no void to improve surface planarization. CONSTITUTION: A gate electrode includes a SiGe layer(10) that is formed on a substrate(2) by interposing a gate insulation layer(6). The gate insulation layer includes a base interface layer(6a) and a high dielectric layer(6b) having a higher relative dielectric constant than that of the base interface layer. The gate electrode includes a seed silicon layer(8) formed on the high dielectric layer and a SiGe layer formed on the seed silicon layer.</p>
申请公布号 KR20050021337(A) 申请公布日期 2005.03.07
申请号 KR20040067669 申请日期 2004.08.27
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. 发明人 MUTOU AKIYOSHI;OHJI HIROSHI
分类号 H01L29/423;H01L21/28;H01L21/314;H01L21/336;H01L21/8238;H01L29/49;H01L29/51;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L29/423
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