| 发明名称 |
Junction substrate and method of bonding substrates together |
| 摘要 |
A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
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| 申请公布号 |
US2005046007(A1) |
申请公布日期 |
2005.03.03 |
| 申请号 |
US20040916203 |
申请日期 |
2004.08.11 |
| 申请人 |
CASIO COMPUTER CO., LTD. |
发明人 |
NAKAMURA OSAMU;TAKEYAMA KEISHI;TERAZAKI TSUTOMU |
| 分类号 |
G01N37/00;B01J19/00;B01L3/00;C01B3/32;C03C17/22;C03C17/34;C03C27/00;C03C27/10;(IPC1-7):H01L21/48;H01L23/52 |
主分类号 |
G01N37/00 |
| 代理机构 |
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