发明名称 |
Heat dissipating device |
摘要 |
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.
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申请公布号 |
US2005047088(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20040900864 |
申请日期 |
2004.07.27 |
申请人 |
XU LI FU;YANG CHIH-HAO;HWANG CHING-BAI |
发明人 |
XU LI FU;YANG CHIH-HAO;HWANG CHING-BAI |
分类号 |
F04D29/58;H01L23/373;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
F04D29/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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