| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board wherein a part of terminal pads for external connection is constituted of an Sn plated layer whose connection reliability with Pb free solder is good, and a method for manufacturing the wiring board. <P>SOLUTION: In the wiring board 1, surface layer portions of the terminal pads 10, 17 for external connection are formed of electroless Sn plated layers 53, 53, in which thermal treatment for smoothing is performed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
