| 摘要 |
PROBLEM TO BE SOLVED: To enhance wetting between aluminum and a metal bonding layer even when bonding a compound plate of aluminum and SiC and a ceramic sinter plate for electrostatic chucking with a metal. SOLUTION: The wafer holding member includes a wafer holding part which uses one principal surface of a plate-like ceramics body as a surface to place a wafer and comprises an electrode on the other principal surface of or within the plate-like ceramics body, and a compound plate containing SiC, aluminum and silicon. A metal layer is provided on a surface of the wafer holding part opposed to the placing surface, a metal layer is provided on a surface of the compound plate, the wafer holding part and the compound plate are bonded via a metal bonding material between these two metal layers, and a ratio tm/t of thickness (t) of the compound plate side metal layer and thickness tm of the metal bonding material is 0.01 to 1. COPYRIGHT: (C)2005,JPO&NCIPI |
