发明名称 LINEAR LEAD-FREE SOLDER WIRE, ITS MANUFACTURING METHOD, AND SOLDER JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a linear lead-free solder wire including flux for forming excellent joining, its manufacturing method, and a solder joining method. SOLUTION: The linear lead-free solder wire has the lead-free solder S and the flux F which are arranged so as to be respectively spiral on the radial cross section. Alternatively, the lead-free solder wire has a plurality of metal layers and flux layers for constituting a lead-free solder alloy which are arranged so as to be respectively spiral on the radial cross section. The flux is applied to one side of the lead-free solder layer and wound to form a roll. A roll is formed by winding. The lead-free solder wire can be obtained by axially extending the roll. Alternatively, the flux is applied to one face of a lead-free solder ribbon. The ribbon is twisted in a twisted paper string shape by winding. The solder joining is executed by using it. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005052856(A) 申请公布日期 2005.03.03
申请号 JP20030285067 申请日期 2003.08.01
申请人 HUMAN UNITEC CO LTD 发明人 SHIMAMURA ISAO;TEJIMA KOICHI
分类号 B23K35/14;B23K35/363;B23K35/40;(IPC1-7):B23K35/14 主分类号 B23K35/14
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