| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device whereon a fuse capable of being melted by a further small current/voltage is mounted, with respect to the fuse having the structure of reducing its melted current/voltage. <P>SOLUTION: Since plates 114, 103, 126, 127 surround the melted portion of a fuse 100, the heat generated in the melted portion 107 of the fuse when making a current flow through the fuse can be confined or accumulated in the vicinity of the melted portion 107 of the fuse. Therefore, the melting of the fuse can be made easy. Also, since the heat generated in the fuse when making a current flow through the fuse concentrates easily to the melted portion by making the shape of the melted portion of the fuse a foldable shape instead of a linear shape, the melting of the fuse can be made further easy. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
