| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive path, by which conductive paths such as interconnections and electrodes can be easily formed without exposing a substrate to a high temperature and vacuum state, and the productivity can be improved. <P>SOLUTION: By hardening conductive paste applied on the surface of the substrate, a first conductive film having a conductivity is formed on the surface of the substrate. The first conductive film is used as an electrolytic plating base film, that is, a plating electrode when forming a second conductive film on top of the first conductive film. In a process of forming the conductive paths by forming the first conductive film by a simple process of hardening the paste without using sputtering, chemical vapor deposition, and vacuum evaporation methods, the substrate is not exposed to vacuum and high temperature. Even if resin members are formed on the substrate, the quality of the resin members is not deteriorated or the resin material thereof is never decomposed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
