发明名称 |
INEXPENSIVE FLEXIBLE FILM PACKAGE MODULE AND METHOD FOR MANUFACTURING SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive flexible film package module and a method for manufacturing the same. SOLUTION: In the flexible film package and the method for manufacturing the same, a first insulation substrate 10 in which the tape film of the flexible film package module is made of a polyimide material and a second insulation substrate 170 less expensive than the first insulation substrate are used in a linked state. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005057258(A) |
申请公布日期 |
2005.03.03 |
申请号 |
JP20040212512 |
申请日期 |
2004.07.21 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KANG SA YOON;KIM DONG HAN;JUNG YE-JUNG |
分类号 |
H01L21/60;G02F1/13;G02F1/1345;H01L23/538;H05K1/11;H05K1/14;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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