发明名称 INEXPENSIVE FLEXIBLE FILM PACKAGE MODULE AND METHOD FOR MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive flexible film package module and a method for manufacturing the same. SOLUTION: In the flexible film package and the method for manufacturing the same, a first insulation substrate 10 in which the tape film of the flexible film package module is made of a polyimide material and a second insulation substrate 170 less expensive than the first insulation substrate are used in a linked state. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005057258(A) 申请公布日期 2005.03.03
申请号 JP20040212512 申请日期 2004.07.21
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KANG SA YOON;KIM DONG HAN;JUNG YE-JUNG
分类号 H01L21/60;G02F1/13;G02F1/1345;H01L23/538;H05K1/11;H05K1/14;(IPC1-7):H01L21/60 主分类号 H01L21/60
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