发明名称 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces |
摘要 |
The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.
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申请公布号 |
US2005045102(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20030652461 |
申请日期 |
2003.08.28 |
申请人 |
ZHENG LINGYI A.;DOAN TRUNG T.;BREINER LYLE D.;PING ER-XUAN;BEAMAN KEVIN L.;WEIMER RONALD A.;KUBISTA DAVID J.;BASCERI CEM |
发明人 |
ZHENG LINGYI A.;DOAN TRUNG T.;BREINER LYLE D.;PING ER-XUAN;BEAMAN KEVIN L.;WEIMER RONALD A.;KUBISTA DAVID J.;BASCERI CEM |
分类号 |
C23C16/44;C23C16/455;C23C16/458;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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地址 |
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