METHOD AND APPARATUS FOR INDIRECT BONDING OF ORTHODONTIC APPLIANCES
摘要
An indirect bonding apparatus is made by initially placing spacer material over a replica (20) of the patient's tooth structure. A tray (30) is then formed over the spacer material and hardened. Next, the spacer material is removed from the tooth replica and orthodontic appliances (34) are placed on the replica at desired locations. A matrix material (40) is placed between the tray and the replica and allowed to harden. Optionally, the apparatus includes features for facilitating removal of the transfer apparatus after the bonding procedure has been completed, and features for applying firm, uniform pressure to the appliances during the bonding procedure. Other aspects of indirect bonding are also described.
申请公布号
WO2004098440(A3)
申请公布日期
2005.03.03
申请号
WO2004US11689
申请日期
2004.04.15
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
CLEARY, JAMES D.,;CINADER, DAVID K.,;PUTTLER, OLIVER L.,;SANKER, JOHN E.,