METHOD FOR PACKAGING CHIP ON LTCC SUBSTRATE INCREASING CONTACTING FORCE BETWEEN BOTH BY USING SCRATCHED SOLDER PAD

摘要

PURPOSE: A method for packaging a chip on a LTCC(Low Temperature Cofired Ceramic) substrate is provided to increase the contacting force between both elements by expanding an contact area by a scratched solder pad. CONSTITUTION: A chip(310) is packaged on a LTCC substrate(300). A scratched solder pad(320) is formed on the LTCC substrate. The chip is adhered on the solder pad by a solder(330). The solder pad is composed of a metal paste. The solder pad is scratched in a tooth-shaped configuration.