| 摘要 |
<p>The invention relates to a cooling element to be used as a heat sink for an electronic device ( 1, 11, 21, 31 ), as a microprocessor, which contains a base member ( 2, 12, 22, 32 ) attached in one side to the electronic device ( 1, 11, 21, 31 ) and in other side providing separate members for distribution ( 3, 17, 23, 33 ) of heat and for supporting a fan ( 6, 15, 25, 35 ) installed in a cavity in the middle of members for distribution ( 3, 17, 23, 33 ) and creating airflow for heat transfer. According to the invention at least one fin member ( 4, 18, 28, 38 ) is installed in space between of two adjacent distribution members ( 3, 17, 23, 33 ).</p> |
