METHOD AND APPARATUS FOR TRANSFERRING SEMICONDUCTOR SUBSTRATES CAPABLE OF PERFORMING THERMAL CURING PROCESS DURING TRANSFERRING OPERATION OF PALETTE

摘要

PURPOSE: A method and an apparatus for transferring semiconductor substrates are provided to improve productivity by performing a thermal curing process during a transferring operation of a palette. CONSTITUTION: A semiconductor substrate(2) having a curing resin applied thereon is mounted on a palette(3) and is transferred into a thermal curing device. The palette is moved up/down using an elevator(4) to be laminated in the thermal curing device. A pork member(5) is implemented on lower portion of both sides of the elevator and locates the palette during elevated by the elevator.