发明名称 SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF CAPABLE OF PREVENTING OXIDATION OF TRANSFER ELECTRODES USING SIDEWALL INSULATING LAYER
摘要 PURPOSE: A solid state imaging device and a manufacturing method thereof are provided to minimize a size of the imaging device by preventing oxidation of transfer electrodes using a sidewall insulating layer on side portions of the transfer electrodes. CONSTITUTION: A solid state imaging device includes a charge transfer portion, a plurality layers of charge transfer electrodes(2A,2B), and sidewall insulating layers(8,11). The charge transfer portion is provided on one side of a light-receiving portion. The charge transfer portion is composed of plural layers of charge transfer electrodes. The sidewall insulating layers are formed on side surfaces of the charge transfer electrodes of respective layers of the charge transfer electrodes.
申请公布号 KR20050019035(A) 申请公布日期 2005.02.28
申请号 KR20040062750 申请日期 2004.08.10
申请人 SONY CORPORATION 发明人 KOKUBUN, KATSUNORI;SATO, MITSURU
分类号 H01L21/28;H01L21/339;H01L27/14;H01L27/146;H01L27/148;H01L29/762;H01L31/10;H04N5/335;(IPC1-7):H01L27/148 主分类号 H01L21/28
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