Al-Cu JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

By leaving an Ag layer in the Al-Cu junction, an Al-Cu junction structure shows behaviors of ductile deformation and fracture, has a tensile strength equivalent to that of the base material Al at the junction, and exhibits excellent junction characteristics. A member with an Al-Cu different material junction having an excellent machinability is reduced in thickness by rolling to obtain a thin Al-Cu junction structure having an excellent dimensional accuracy and adapted to dimensional applicability corresponding to the diversification of size. The thus-obtained thin Al-Cu junction structure has the lightweight property of Al and the heat transfer property, thermal diffusion property and corrosion resistance property of Cu, while responding to the demand of a miniaturized, thinner, lighter, higher performance electronic device. Therefore the structure can be widely utilized as a heat exchanger material or a heat transfer material.