| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer heating apparatus which can homogenize surface temperature of a wafer in both steady thermal insulation process and the preceding heating process with curbing heat transmission from a heat-homogenizing plate to a guide member. SOLUTION: The wafer heating apparatus comprises a heat-homogenizing plate including a ceramic substrate of which the upper surface is the surface for mounting a wafer and a heating element arranged inside or on the lower surface of the ceramic substrate, lift pins piercing through-holes running through the heat-homogenizing plate to move the wafer up and down, a guide member having a guiding hole in which the lift pin is guided to pass through. The guide member of this apparatus is arranged so that the upper end surface of the guide member is contact with the lower surface of the heat-homogenizing plate in order to connect the through-hole to the guiding hole. The upper end surface of the guide member has an annular shape with the thickness of 0.1 to 0.3 mm. The guide member has lower heat conductivity than the ceramic substrate. This reduces heat transmission from the heat-homogenizing plate to the guide member. COPYRIGHT: (C)2005,JPO&NCIPI
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