| 摘要 |
PROBLEM TO BE SOLVED: To mechanize the process of assembling a very small electronic component and to achieve homogeneity in product quality. SOLUTION: A step of welding, a step of insertion into a cylinder, and a step of immersion are successively performed for the assembly of the electronic component. In the step of welding, leads 5, 5 are welded to the two electrodes of an electronic element chip 2; in the step of insertion into a cylinder, the pair of electrodes 5, 5 attached to the element chip 2 are inserted into a pair of holes 6, respectively, formed in a cylinder 3; and, in the step of immersion, the element chip 2 held by the cylinder 3 is immersed together with a part of the cylinder 3 in a molten glass for the electronic chip 2 and the part of the cylinder 3 to be coated with the glass. As the result, the molten glass sticks to the element chip 2 and to the part of the cylinder 3 for the formation of a glass coating 4 that bridges the two. COPYRIGHT: (C)2005,JPO&NCIPI
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