| 摘要 |
PROBLEM TO BE SOLVED: To provide an inkjet recording head chip that has an electrode capable of providing an enough bonding area, and is manufactured in a simple process. SOLUTION: An Ni film 24 and an Au film 25 are formed on a pad 13 by an electroless plating process. The Ni film 24 is selectively plated on an opening section of an aluminum pad 22. The Au film 25 is formed on the Ni film 24 by the electroless plating process. After the alignment of the chip 101 and a plurality of leads 31 of a conductor film are carried out, the leads 31 are heated to be pressed against the pad 13 so that the plurality of leads 31 are integrally bonded to the pad 13 on the chip 101 by the heat and the weight. As the pad 13 is in roughly a rectangular shape, it is possible to make a bonding region 52 between the pad 13 and the leads 31 wide. As the thickness of a portion which is plated with the Au film 25 is attained enough, the warpage of the chip 101 and the variation of the leads 31 can be avoided, and then it is possible to surely connect the leads 31 with the chip 101. COPYRIGHT: (C)2005,JPO&NCIPI
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