| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology that dispenses with the coating of the solder resist on surfaces in a film carrier tape to which CSP technology is applied, a semiconductor assembly and a semiconductor device and methods of manufacturing these articles and a mounted substrate and an electronic device. SOLUTION: The semiconductor device dispensing with the coating of the solderless resist on the surface is provided. Since a lead 54 is formed on one surface of a polyimide film 10, an external connection terminal 11 is formed on the lead 54 through a via hole 30 so as to allow the terminal to protrude from the other surface of the polyimide film 10, and an IC chip 15 is adhered to one surface, the lead 54 is covered with the IC chip 15, and the coating of the solderless resist can be omitted. COPYRIGHT: (C)2005,JPO&NCIPI |
