| 摘要 |
The present invention provides a vacuum film formation method for forming a deposition layer by facing a deposition source, which emits a deposition material, and a substrate towards each other; moving the deposition source and the substrate relatively to each other, while keeping an interval between the deposition source and the substrate; and depositing the deposition material from the deposition source onto the substrate. The vacuum film formation method includes the steps of: emitting the deposition material of a constant width from the deposition source in the shape of a strip; and moving the deposition source and the substrate relatively to each other in directions including a first direction, which is orthogonal to a width direction of the strip of the deposition material emitted in the shape of the strip, and a second direction different from the first direction.
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