发明名称 SOCKET FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a socket for an electronic component in which the machining performance and assembling property of an electrode are improved and the thickness of a socket body itself can be made thin and which is economical in terms of cost. <P>SOLUTION: The electrode part 2a comprises a blade spring 7 in which a conductive plate material is bent in nearly a U-shape and an opening 7 is formed facing the direction nearly orthogonally crossing the thickness direction of the socket main body 2, a first contact 8a which is provided at one free end of the blade spring 7 and contacts the electrode terminal of an electronic component, a second contact 8b which is provided at the other free end of the blade spring 7 and contacts the electrode terminal of a printed-circuit board as described later. The blade spring 7 comprises a horizontal side 71 which is arranged in nearly parallel to the horizontal surface of the printed-circuit board, a coupling side which is provided at one end of the horizontal side 71 facing the thickness direction B of the socket body 2, and a slant portion 73 which is formed at the end of the coupling side 72 opposed to the horizontal side 71 so as to stand up inclined facing the electronic component, and engaging members 72a, 72b which are engaged with an engaging groove 55 formed at a partition wall 54a are provided at both sides of the coupling side 72. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005044545(A) 申请公布日期 2005.02.17
申请号 JP20030200634 申请日期 2003.07.23
申请人 OTAX CO LTD 发明人 MOTOHASHI SENTARO
分类号 H01R13/11;H01L23/32;H01R13/24;H01R13/428;H01R33/76 主分类号 H01R13/11
代理机构 代理人
主权项
地址