| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module equipped with a base plate that is improved in bending rigidity in its longitudinal direction at a given thickness. <P>SOLUTION: In the power semiconductor module, a substrate (50) is provided on the base plate (20), and the base plate (20) has a reinforcing structure (24). The structure (24) is extended in the longitudinal direction of the base plate (20) formed by deforming a base plate material, and protruded from the surface provided by the base plate (20). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
