摘要 |
<p>A radiating structure of electronic equipment, comprising a printed circuit board (26), a plurality of heating parts (32) mounted on the printed circuit board, and a radiating unit (34) formed so as to cover the plurality of heating parts, the radiating unit further comprising a unit body (36) detachably installed on the heating parts and an air straightening plate (38) installed on the unit body so as to change the air flows around the heating parts, whereby since the air straightening plate changing the air flows around the heating parts is installed on the unit body, heat can be effectively radiated from the plurality of heating parts and, accordingly, the degree of freedom of the arrangement of the plurality of heating parts is increased and the radiating structure of the electronic equipment suitable for high-density mounting can be provided.</p> |
申请人 |
FUJITSU LIMITED;INOUE, TAKASHI;TSUTSUMI, KENJI;JOKO, KENJI;MIZUKOSHI, YUKIO;SATO, SEIICHIRO;TOSHIMITSU, KENJI;MATSUNAGA, KATSUKI |
发明人 |
INOUE, TAKASHI;TSUTSUMI, KENJI;JOKO, KENJI;MIZUKOSHI, YUKIO;SATO, SEIICHIRO;TOSHIMITSU, KENJI;MATSUNAGA, KATSUKI |