| 摘要 |
PROBLEM TO BE SOLVED: To provide a method where a hybrid product is inexpensively and easily fabricated without additional process steps, in addition, topography effects are avoided. SOLUTION: A through metalized-base-material 4 is printed on several wiring planes 2, 3; at least one appropriate sintering-step is performed to bind the metalized base material 4; and the sintered metalized-base-material 4 that is exposed is thoroughly and chemically covered with at least one of covering materials 8, 9, 10. COPYRIGHT: (C)2005,JPO&NCIPI |
