发明名称 CERAMIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a ceramic circuit board which is high enough in electric conductivity capable of restraining cracks from occurring in a solder layer between Si chips or the like and the ceramic circuit board even when a high power is applied, and excellent in reliability. SOLUTION: The ceramic circuit board is equipped with a ceramic board primarily formed of nitride ceramic and a metal circuit layer which is formed on the one main surface of the ceramic board and contains, at least, one element selected out of molybdenum and tungsten, and copper. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005044832(A) 申请公布日期 2005.02.17
申请号 JP20030199881 申请日期 2003.07.22
申请人 TOSHIBA CORP 发明人 SHIRAI TAKAO
分类号 H01L23/14;(IPC1-7):H01L23/14 主分类号 H01L23/14
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