WORKING METHOD AND WORKING DEVICE OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a working method and a working device of a substrate for satisfying quality (work precision and absence of defect in chipping) and cost (work speed and device cost) in removal work for working the surface of a substrate such as a wafer into a high flat shape. SOLUTION: A substrate holding means 12 rotates a workpiece W while it is held. A nozzle moving means 16 moves a nozzle 14 along the surface of the workpiece while work liquid including free abrasive supplied from a work liquid supply means 18 is jetted from the tip of the nozzle 14. Work liquid is applied to the surface of the workpiece W and the workpiece is worked. COPYRIGHT: (C)2005,JPO&NCIPI