| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for exposure by which the throughput can be improved at the time of performing multiple exposures on a plurality of substrates, and to provide a substrate treating system that can improve the productivity of a device on both aspects of the throughput and yield. SOLUTION: After first exposures are successively performed on n pieces of wafers (steps 208, 308, etc.), second exposures are again successively performed on the wafers in a state where the wafers are not developed (208, 308, etc.). Since the first and second exposures can be performed by changing the exposing condition, such as the lighting condition etc., one time only when the change of the exposing condition is required between the first and second exposures (step 200), the speed regulation of the changing time of the exposing condition is not required as compared with the case where the exposing condition is changed whenever the exposure of one wafer ends. Therefore, the throughput can be improved in the case where time is required for, particularly, changing the exposing condition. In addition, in the case of performing multiple exposures of triple exposure or more, third exposure, fourth exposure, etc., can be performed similarly on the n pieces of wafers continuously from the second exposure without developing any wafer. COPYRIGHT: (C)2005,JPO&NCIPI
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