| 摘要 |
The invention relates to a method of optimising the cooling of subassemblies in micro-computers consisting of a casing (10) comprising an extractor (13) which is connected to a converter block (12), a read block (10), an air inlet wall (P1) having holes which are equipped with dust filters, a hole-equipped air outlet wall (Q1), and an assembly of boards (C 11 to C 15) comprising dissipating elements. The inventive method comprises the following steps: creation of a main cooling air flow (Fa1) with the production of a vacuum in the casing between the inlet wall (P1) and the outlet of the extractor (13); creation of a secondary cooling air flow (Fb1) by means of entrainment due to the presence of the main air flow (Fa1) between the air inlet wall (P1) and the air outlet wall (Q1); and installation of boards (C11 to C15) comprising dissipating elements which are disposed in parallel to the direction of the secondary cooling air flow. |
