| 摘要 |
PROBLEM TO BE SOLVED: To provide a high dielectric sheet which can have sufficient strength and a high dielectric constant without deteriorating thermal resistance and insulation, its manufacturing method, a wiring circuit board using the high dielectric sheet, and a method for manufacturing the wiring circuit board. SOLUTION: A porous resin film 11 made of polyimide, aramid, or the like is formed on a conductor layer. High dielectric fine particles 20 are synthesized by incorporating metal alkoxide into pores 12 of the porous resin film 11, and by performing the dehydration and condensation polymerization of the metal alkoxide in the pores 12 of the porous resin film 11. A high dielectric sheet 1 is manufactured by this method. A wiring pattern is formed on the conductor layer. COPYRIGHT: (C)2005,JPO&NCIPI |
