发明名称 METAL BASE CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a metal base circuit substrate which can mount various sorts of semiconductor elements, electronic components, electric components, etc. by devising it in such a manner that the characteristics of the circuit substrate can be partially varied even on the same circuit substrate. SOLUTION: In the metal base circuit substrate having a circuit provided on a metallic plate via an insulating layer, a recess is provided in one surface of the metallic plate so that the periphery of the recess is not open. The insulating layers made of the same material are provided both on the gap of the recess and on the metallic surface thereof having the recess. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005039112(A) 申请公布日期 2005.02.10
申请号 JP20030275979 申请日期 2003.07.17
申请人 DENKI KAGAKU KOGYO KK 发明人 TSUJIMURA YOSHIHIKO;YONEMURA NAOKI;YASHIMA KATSUNORI
分类号 H05K1/05;H01L23/12;(IPC1-7):H05K1/05 主分类号 H05K1/05
代理机构 代理人
主权项
地址