| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device sealed by a resin, for suppressing flowing-in of an outer layer resin to a vibration space and particularly adhesion of the outer layer resin to electrode lands on a mount substrate and capable of promoting downsizing. SOLUTION: In the surface acoustic wave device 1 sealed with the outer layer resin 32 wherein a surface acoustic wave element 6 is mounted on the mount substrate 2 on the upper side of which the electrode lands 3 to 5 are formed through flip-chip bonding by directing an electrode forming face downwardly, a square annular dam 25 made of a resin is formed to the surrounding of the electrode forming face of a surface acoustic wave substrate of the surface acoustic wave element and corners 3a, 4a, 4b, 5a of the electrode lands 3 to 5 close to corners of the dam 25 are formed rounded to extend the distance from the corners 3a, 4a, 4b, 5a to the corners of the dam. COPYRIGHT: (C)2005,JPO&NCIPI
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