发明名称 SEMICONDUCTOR DEVICE EQUIPPED WITH THERMAL SHUTDOWN CIRCUIT
摘要 PROBLEM TO BE SOLVED: To reduce the consumption current in at least a temperature security region of operation in a semiconductor device equipped with a thermal shutdown circuit. SOLUTION: An n-channel MOS transistor 17 for a switch is prepared in a power supply wiring 11 for supplying power to a thermal shutdown circuit 1. The gate electrode of the transistor 17 is connected with a GND wiring 15. The threshold voltage of the transistor 17 is set as a value wherein a channel current is not passed in the temperature security region of operation of the semiconductor device, and a leakage current is generated in a prescribed high temperature region which current can operate the thermal shutdown circuit 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005038921(A) 申请公布日期 2005.02.10
申请号 JP20030197671 申请日期 2003.07.16
申请人 RICOH CO LTD 发明人 HASHIGAMI HIROYUKI
分类号 H01L27/04;H01L21/822;(IPC1-7):H01L21/822 主分类号 H01L27/04
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