METHOD FOR RECOGNIZING WORK IN DIE BONDER AND DIE BONDER

摘要

In order to perform image recognition at higher speed and with higher accuracy in a die bonder, a first high-function camera (100) is disposed fixedly above a position coated with bonding material (PS) located on this side in the middle of carrying passage of a carrier (70) and a second high function camera (110) is disposed fixedly above the bonding position (PB) of a semiconductor chip located on the forward side in the middle of carrying passage of the carrier (70). The first high function camera (100) image-recognizes the coating state of bonding material for all bonding regions (2) collectively at least in one row in the widthwise direction of a substrate, and the second high function camera (110) image-recognizes the bonding state of the semiconductor chip for all bonding regions (2) collectively at least in one row in the widthwise direction of the substrate (1).