发明名称 |
Light-emitting diode lamp |
摘要 |
A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
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申请公布号 |
US2005030762(A1) |
申请公布日期 |
2005.02.10 |
申请号 |
US20040911643 |
申请日期 |
2004.08.05 |
申请人 |
TOYODA GOSEI CO., LTD.;KOHA CO., LTD. |
发明人 |
KATO HIDEAKI;MATSUMURA KANAE;OHTSUKA SHUNSUKE |
分类号 |
H01L23/12;H01L25/075;H01L33/48;H05K3/34;(IPC1-7):B60Q1/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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