<p>A heat source is disposed in a thermally conductive mass for imparting heat to the mass. Fluid in a flow path through the mass absorbs heat from the mass. Substantially all of the surface area of one or more heater elements forming the heat source are insert molded in the mass in direct contact to the mass. The mass may be cast using a sub-liquidous temperature material for low porosity and high thermal conductivity.</p>
申请公布号
WO2005013644(A1)
申请公布日期
2005.02.10
申请号
WO2004US23618
申请日期
2004.07.22
申请人
VALEO ELECTRICAL SYSTEMS, INC.;KUEBLER, KARL-HEINZ;HARRIS, DARYL, G.